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Bent sockets: According to Intel, they meet Alder Lake specifications

Bent sockets: According to Intel, they meet Alder Lake specifications

from benjamin grundken
Since the release of the Alder Lake S processors and the associated LGA 1700, reports of bent sockets and ultimately also CPUs and heat sinks have appeared on the internet time and time again. Intel has now taken a position on this issue and emphasized that a slight drop is normal and to be expected. Alternative solutions for more uniform contact pressure could void the manufacturer’s warranty.

There are many reports on the internet about bent sockets and heat sinks on Alder Lake S processors. CPUs are probably not proven to be damaged, let alone broken, but the uneven contact pressure associated with certain coolers has been reported to degrades cooling performance. Intel has now commented on this issue. According to the CPU manufacturer, “slight sagging” is not an issue, is to be expected, and is not detrimental to in-spec operation.

Alder Lake: According to Intel, a slight flex is normal

Specifically, Intel told Tom’s Hardware: “We have received no reports of 12th Gen Intel Core processors running out of specs due to Integrated Heat Spreader (IHS) changes. Our internal data shows that the IHS in the Gen 12 desktop processors may exhibit a slight deviation once installed in the socket. Such a slight deviation is to be expected and will not cause the processor to perform out of specification.”

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Intel also comments on workarounds recommended by various users and portals. “We strongly discourage modifications to the socket or independent charging mechanism. Such modifications will cause the processor to operate out of specification and may void product warranties.”

According to Intel, there is neither a problem nor a need for a solution. The socket or processor reportedly doesn’t bend per se, but in relation to certain coolers and backplanes, that is, in the broader sense of the mounting solution, there may be a different degree of bending. The background seems to be that the LGA-1700 is larger overall, but also more rectangular than its predecessor, and the IHS distributes pressure more unevenly in some cases. Some of the alternative solutions circulating on the Internet promise significant improvements in temperature.

Source: tom hardware