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GPU modification: GDDR6X temperature greatly reduced with copper pads

Image: DandyWorks (YouTube)

The GDDR6X memory in modern graphics cards can get very hot and, despite being cold, can reach temperatures of over 100°C. the modifier dandyworks presents a more efficient method in a video: With small copper plates he was able to reduce the temperature by more than 40 °C. But he is not the first to try.

The GDDR6X memory in the Asus TUF RTX 3070 Ti by dandyworks they reached temperatures of up to 106 °C before the procedure. After the modification, the temperature dropped to 64°C, which is a total of 42°C.

To do this, the cooler had to be completely removed first, and the memory was installed with flat copper plates. The modder chose these with the same thickness as the thermal pads previously located above the memory chips (~1.5mm). Previously, however, memory modules were lined with Kapton tape to prevent potential short circuits, as copper is known to be an excellent conductor of not only heat but also electricity. And in the immediate vicinity of the chips are some current-carrying components.

The copper plates were then placed on top of the chips with thermal paste and also glued on top to make good contact with the cooler, which was then mounted as before.

others had the idea

Other hobbyists also came up with this idea. For example, the operator of the YouTube channel Overclocking Unleashed Significantly reduce GDDR6X temperature on various GeForce graphics cards like the following from HardwareLuxx compiled videos show:

The temperature advantage with these was not as great as with the most recent example, but the initial temperature before modification was also considerably lower.

The accumulator is not too hot at 100 °C

Even if alarm bells go off for many users at temperatures of 100 °C, this is still not a problem for GDDR6X memory. Micron, for example, specifies an operating temperature for its memory up to 105°C and there is still room for improvement on this limit. graphics card dandyworks it simply breaks this limit, but can also be considered as a particularly attractive candidate.

Therefore, quite complex intervention in storage cooling is not absolutely necessary. However, tests show that manufacturers can effectively prevent extremely high storage temperatures with targeted use of materials, ultimately benefiting component longevity as well.

Ultimately, however, inferior thermal pads can also be the cause of very high memory temperatures, such as a report from igor’s lab has pointed out. However, the author does not see a general problem.

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